Some recent papers from Acta

September 4, 2010

[1] Coupling of grain boundary sliding and migration within the range of boundary specialness

A D Sheikh-Ali

Stress-induced behavior of high-angle near-coincidence symmetric tilt boundaries has been examined in bicrystal specimens of zinc. Parameters of coupling between boundary sliding and migration were determined. The angular deviation from the coincidence misorientation within the range of boundary specialness has a noticeable effect on the sliding-to-migration ratio, called “coupling factor”. Mechanisms of coupled boundary sliding and migration based on the motion of edge-type extrinsic and intrinsic grain boundary dislocations are discussed. It has been demonstrated that the observed alteration of the coupling factor with the change in boundary misorientation is due to the change of the parameters of extrinsic secondary grain boundary dislocations. The obtained results have also shown the limitation of the coincidence site lattice/displacement shift complete lattice model for the quantitative description of the structure of near-coincidence boundaries.

[2] Diffusion-controlled peritectic reaction process in carbon steel analyzed by quantitative phase-field simulation

M Ohno and K Matsuura

The peritectic reaction process in carbon steel, L + δ → γ, has been analyzed by a quantitative phase-field simulation. The calculated moving velocities of the γ–L and γ–δ planar interfaces in the isothermal peritectic transformation precisely agree with the corresponding experimental data, which strongly supports the accuracy of the present simulation. The diffusion-controlled peritectic reaction rate and the growth velocity of the γ phase along the δ–L interface obtained by the present simulation were fairly consistent with the experimentally measured values. This indicates that recent experimental findings can be explained by a diffusion-controlled mechanism. This is in marked contrast to the claims made on the basis of the experimental data and an analytical model that the peritectic reaction is not controlled by the diffusion of carbon.

[3] Spacing characterization in Al–Cu alloys directionally solidified under transient growth conditions

M Amoorezaei et al

We study spacing selection in directional solidification of Al–Cu alloys under transient growth conditions. New experimental results are presented which reveal that the mean dendritic spacing vs. solidification front speed exhibits plateau-like regions separated by regions of rapid change, consistent with previous experiments of Losert and co-workers. Quantitative phase-field simulations of directional solidification with dynamical growth conditions approximating those in the experiments confirm this behavior. The mechanism of this type of change in mean dendrite arm spacing is consistent with the notion that a driven periodically modulated interface must overcome an energy barrier before becoming unstable, in accord with a previous theory of Langer and co-workers.

[4] Microstructure evolution during dewetting in thin Au films

C M Mueller and R Spolenak

Thin metal films can degrade into particles in a process known as dewetting. Dewetting proceeds in several stages, including void initiation, void growth and void coalescence. Branched void growth in thin Au films was studied by means of electron backscatter diffraction (EBSD). The holes were found to protrude into the film predominantly at high angle grain boundaries and the branched shape of the holes can be explained by surface energy minimization of the grains at the void boundaries. (1 1 1) Texture sharpening during dewetting was observed and quantified by EBSD and in situ X-ray studies.

[5] Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti–Ni–Cu thin film microactuator

M Tomozawa et al

Ti–Ni–Cu/SiO2 two layer diaphragm-type microactuators were fabricated by sputter deposition and micromachining. The influence of heat treatment temperature on the actuation behavior was investigated under quasi-static conditions. The interfacial structure of Ti–Ni–Cu/SiO2 and internal structure of the Ti–Ni–Cu layer were also investigated using transmission electron microscopy. The reaction layer formed between the Ti–Ni–Cu and SiO2 layers, and preferentially grew into the SiO2 side. The reaction layer formed at 1023 K mainly consisted of Ti4(Ni,Cu)2O. The maximum height of the diaphragm decreased with increasing heat treatment temperature. The growth of the reaction layer also affected the microstructure of the Ti–Ni–Cu layer. The density of fine platelets and Ti2Ni precipitates decreased with increasing heat treatment temperature from 873 to 923 K, and they disappeared at 973 K due to the fact that the reaction layer mainly consisted of a Ti-rich phase. The microactuator heat treated at 973 K showed the highest transformation temperature with the lowest transformation temperature hysteresis, which is attractive for high speed actuation.


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